Intel's $28 billion Ohio chip fabrication plant faces significant delay, with completion now expected no earlier than 2030, citing financial constraints and market demand alignment.
Intel pushes back the opening of its $28 billion Ohio chip plant to 2030, citing a need for a financially responsible approach amid delays and financial struggles.
Chinese companies are circumventing US chip export restrictions by purchasing Nvidia's Blackwell chips through third-party traders in Malaysia, Taiwan, and Vietnam, raising concerns about the effectiveness of these controls.
Taiwanese chipmaker TSMC announces massive investment in US-based fabrication plants, expanding its network of semiconductor factories and boosting domestic production.
Taiwan Semiconductor Manufacturing Co. invests $100 billion in US chipmaking, building two new factories in Arizona, creating thousands of jobs and producing advanced AI chips.
ARM Holdings partners with Malaysian government to bolster chip design ecosystem, as country aims to become hub for chip manufacturing within the next decade
German semiconductor manufacturer Infineon teams up with Indian chipmaker CDIL to support India's transition to electric mobility and renewable energy, leveraging power semiconductors.
Intel names Lip-Bu Tan, a renowned figure in the semiconductor industry, as its new CEO, succeeding interim co-CEOs David Zinsner and Michelle Johnston Holthaus.
Intel appoints veteran semiconductor executive Lip-Bu Tan as its new CEO, following Pat Gelsinger's retirement, to steer the company towards a brighter future.
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